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Sensata SOJ 封装测试座/老化座SOJ Test &Burn-in socket 


Small Outline J–Leaded Packages (SOJ Series)

• 
Compact design and small foot print ensure high density mounting on the board
• 
High reliability with compound spring contact
• 
Zero insertion force to realize easy handling of IC package in operation
• 
Automatic machine applicable for loading/unloading
• 
Open top

Specifications
Current Rating
Max. 1 Amp
Insulation Resistance
Min. 1,000 M ohm
Dielectric Strength
AC 1,000 V-RMS / 1 Min
Initial Contact Resistance
Max. 30m ohm at DC 10mA
Operating Temperature
-65°C to +150°C
Durability
Min. 10,000 Cycles
DIAGRAM

SOJ Series Diagram


Pin Availability
No. of Pos.
A
B
C
D
E
Mil
IC Insertion
2026
22.70
15.24
14.50
17.60
13.78
300
 
2026A
22.70
15.24
15.37
17.60
13.78
300
 
24B
21.43
13.97
15.37
16.33
13.78
300
 
2426
22.70
15.24
14.50
17.60
13.78
300
Dead
26
22.70
15.24
14.50
17.60
13.78
300
Bug
2426B
22.70
15.24
15.37
17.60
13.78
300
 
26B
22.70
15.24
15.37
17.60
13.78
300
 


NUMBERING

soj numbering

1 =
Series Name
2 =
Body Material-AA: PEI Glass Filled
3 =
Contact Finish-33: Gold Plating - 10µ"
4 =
Contact Pitch-A: 1.27mm
5 =
IC Package Row to Row, 0: 300 mil, A: 350 mil, B: 400 mil
6 =
Pin Numbers
7 =
Variation:
(Blank) : Socket Height 14.50mm
B : Socket Height 15.37mm

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