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Sensata PGA 封装测试座/老化座PGA Test &Burn-in socket 


Pin Grid Array (PGA) Series

 
A strong, metal cam activates the normally closed contacts preventing dependency on plastic for contact force
 
The handle can be provided on either the right– or left–hand side (Consult a product specialist for special requirements)
Specifications
Specifications
  1. Socket body is black UL 94V-O polyphenylene sulfide (PPS)
  2. Contacts are either beryllium copper alloy 174, ½ hard or spinodal alloy
  3. Handle is stainless steel
  4. Contact current rating = 1 amp
  5. Accepts leads 0.014–0.026 (0.36–0.66) in diameter, 0.120–0.290 (3.05–7.37) long
Plating option for spinodal alloy contact
  1. "6" 50&#micro; (1.27&#micro;m) min. nickel boron
Plating options for beryllium copper contact
  1. "2": 30&#micro; (.76&#micro;m) min. Gold per Mil-G-45204 on contact area. 100&#micro; (2.54&#micro;m) min. Tin per Mil-T-10727 on solder tail, both over 30&#micro; (76&#micro;m) min. Nickel per QQ-N-290 all over.
  2. "3": 30&#micro; (.76&#micro;m) min. Gold per Mil-G-45204 on contact area. 10&#micro; (.25&#micro;m) min. Gold per Mil-G-45204 on solder tail, both over 30&#micro; (76&#micro;m) min. Nickel per QQ-N-290 all over.
Operating Temperatures
  1. -85°F to 221°F (-65°C to 105°C) tin plating
  2. -85°F to 257°F (-65°C to 125°C) gold plating
  3. -85°F to 392°F (-65°C to 200°C) nickel plating spinodal
Mounting Considerations
  1. Suggested PCB hole size = .032 ± .002 (.81 ± .05 dia.)
  2. Plugs into standard PGA sockets

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