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Series X55X High-Temperature Universal Zero-Insertion-Force DIP Test Socket
FEATURES
Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers
All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers
Contacts are normally closed to eliminate dependence on plastic to sustain contact
Socket handle can be configured with closed contacts (on) when in the UP or DOWN
position, and can be mounted on either the right or left side
Sockets can be soldered into PCBs. Socket fits into Aries’ test socket receptacle on
Data Sheet 10003 |
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SPECIFICATIONS
Socket Body: natural UL 94V-0 Glass-filled Polyetheretherketone (PEEK)
Handle: Stainless Steel
Contacts: Beryllium-Nickel 360, 1/2-hard
Contact Plating: 50μ [1.27μm] Nickel-Boron
Contact Current Rating: 1 amp
Operating Temperature: minimum -67°F [-55°C]; maximum 482°F [250°C]
Retention Force (closed): 55 grams/pin based on a 0.020 [0.51] diameter test lead
Insulation Resistance: 1000 MOhms minimum
Dielectric Withstanding Voltage: 1000 VAC
Life Cycle: 25,000 to 50,000 cycles
Accepts Leads: 0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long |
MOUNTING CONSIDERATIONS
See socket footprint below
DO NOT LEAVE THE SOCKET ON THE “CONTACT OPEN” OR “OFF POSITION” WHILE UNDER TEMPERATURE IN THE BURN-IN OVEN |
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